Siêu Thị Máy Chủ » Bộ Vi Xử Lý » Socket 1366 UP Xeon Intel Xeon Quad core W3580 3.33Ghz (Code Name: BX80601W3580 ; AT80601002274AB)

Intel® Xeon® Bloomfield Quad Core W3580 3.33GHz 8MB cache, 6.4GT/s Intel QPI, Turbo Boost, Hyper-Threading.

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General information Model number W3580 CPU part number AT80601002274AB Box part number BX80601W3580 Frequency (MHz) 3333 Bus speed (MHz) 3200 MHz QPI Package 1366-land Flip-Chip Land Grid Array (FC-LGA8) 1.77" x 1.67" (4.5 cm x 4.25 cm) Socket Socket 1366 Architecture / Microarchitecture Processor core Bloomfield Core stepping D0 (SLBET) Manufacturing process 0.045 micron Data width 64 bit Number of cores 4 Floating Point Unit Integrated Level 1 cache size 4 x 32 KB instruction caches 4 x 32 KB data caches Level 2 cache size 4 x 256 KB Level 3 cache size 8 MB Physical memory (GB) 24 Multiprocessing Uniprocessor Features MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 SSE4.1 SSE4.2 EM64T technology Virtualization technology Execute Disable bit Turbo Boost Technology Hyper-Threading technology Low power features Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology On-chip peripherals Integrated 3-channel DDR3 SDRAM Memory controller Quick Path Interconnect Electrical/Thermal parameters V core (V) 0.8 - 1.375 Minimum/Maximum operating temperature (°C) 5 - 67.9 Minimum/Maximum power dissipation (W) 12 (TDP in C6 state) / 224.42 Thermal Design Power (W) 130 Notes on Intel AT80601002274AB Memory controller supports DDR3-800, DDR3-1066 and DDR3-1333 memory STT Nhà cung cấp Liên hệ Tiền/Mua 1 Công Ty TNHH Siêu Siêu Nhỏ Địa chỉ chính: 254A Nguyễn Đình Chiểu - phường 6 - Quận 3 - Tp.Hồ Chí Minh Địa chỉ 1: 57 Láng Hạ - Thành Công Tower P. 1002, Ba Đình, HN   27,019,200 VNĐ General information Model number W3580 CPU part number AT80601002274AB Box part number BX80601W3580 Frequency (MHz) 3333 Bus speed (MHz) 3200 MHz QPI Package 1366-land Flip-Chip Land Grid Array (FC-LGA8) 1.77" x 1.67" (4.5 cm x 4.25 cm) Socket Socket 1366 Architecture / Microarchitecture Processor core Bloomfield Core stepping D0 (SLBET) Manufacturing process 0.045 micron Data width 64 bit Number of cores 4 Floating Point Unit Integrated Level 1 cache size 4 x 32 KB instruction caches 4 x 32 KB data caches Level 2 cache size 4 x 256 KB Level 3 cache size 8 MB Physical memory (GB) 24 Multiprocessing Uniprocessor Features MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 SSE4.1 SSE4.2 EM64T technology Virtualization technology Execute Disable bit Turbo Boost Technology Hyper-Threading technology Low power features Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology On-chip peripherals Integrated 3-channel DDR3 SDRAM Memory controller Quick Path Interconnect Electrical/Thermal parameters V core (V) 0.8 - 1.375 Minimum/Maximum operating temperature (°C) 5 - 67.9 Minimum/Maximum power dissipation (W) 12 (TDP in C6 state) / 224.42 Thermal Design Power (W) 130 Notes on Intel AT80601002274AB Memory controller supports DDR3-800, DDR3-1066 and DDR3-1333 memory