Siêu Thị Máy Chủ » Bộ Vi Xử Lý » Socket 1156 Intel® Xeon® Quad Core X3480, 3.06 GHz, 8M Cache, Turbo, HT (Code Name: BX80605X3480)

Intel® Xeon® Lynnfield Quad Core X3480 3.06GHz 8MB cache, 2.5GT/s Intel QPI, Turbo Boost, Hyper-Threading.

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General information Model number  X3480 CPU part number BV80605002505AH Box part number BX80605X3480 Frequency (MHz) 3067 Bus speed (MHz)  2.5 GT/s DMI Clock multiplier 23 Package 1156-land Flip-Chip Land Grid Array (FC-LGA8) 1.48" x 1.48" (3.75 cm x 3.75 cm) Socket Socket 1156 (LGA1156)   Architecture / Microarchitecture Core stepping  ?  B1 (SLBPT) Manufacturing process 0.045 micron 774 million transistors Die size 296 mm2 Data width 64 bit Number of cores 4 Floating Point Unit Integrated Level 1 cache size 4 x 32 KB instruction caches 4 x 32 KB data caches Level 2 cache size 4 x 256 KB Level 3 cache size 8 MB Multiprocessing Uniprocessor Features MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 SSE4.1  SSE4.2  EM64T technology Virtualization technology (VT-x and VT-d) Execute Disable bit   Turbo Boost Technology  Trusted Execution Technology Hyper-Threading technology Low power features Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology  On-chip peripherals Integrated 2-channel DDR3 SDRAM Memory controller Direct Media Interface PCI Express interface   Electrical/Thermal parameters Thermal Design Power (W)  95   Notes on Intel BV80605002505AH Memory controller supports DDR3-800, DDR3-1066 and DDR3-1333 memory STT Nhà cung cấp Liên hệ Tiền/Mua 1 Công Ty TNHH Siêu Siêu Nhỏ Địa chỉ chính: 254A Nguyễn Đình Chiểu - phường 6 - Quận 3 - Tp.Hồ Chí Minh Địa chỉ 1: 57 Láng Hạ - Thành Công Tower P. 1002, Ba Đình, HN   15,804,500 VNĐ General information Model number  X3480 CPU part number BV80605002505AH Box part number BX80605X3480 Frequency (MHz) 3067 Bus speed (MHz)  2.5 GT/s DMI Clock multiplier 23 Package 1156-land Flip-Chip Land Grid Array (FC-LGA8) 1.48" x 1.48" (3.75 cm x 3.75 cm) Socket Socket 1156 (LGA1156)   Architecture / Microarchitecture Core stepping  ?  B1 (SLBPT) Manufacturing process 0.045 micron 774 million transistors Die size 296 mm2 Data width 64 bit Number of cores 4 Floating Point Unit Integrated Level 1 cache size 4 x 32 KB instruction caches 4 x 32 KB data caches Level 2 cache size 4 x 256 KB Level 3 cache size 8 MB Multiprocessing Uniprocessor Features MMX instruction set SSE SSE2 SSE3 Supplemental SSE3 SSE4.1  SSE4.2  EM64T technology Virtualization technology (VT-x and VT-d) Execute Disable bit   Turbo Boost Technology  Trusted Execution Technology Hyper-Threading technology Low power features Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology  On-chip peripherals Integrated 2-channel DDR3 SDRAM Memory controller Direct Media Interface PCI Express interface   Electrical/Thermal parameters Thermal Design Power (W)  95   Notes on Intel BV80605002505AH Memory controller supports DDR3-800, DDR3-1066 and DDR3-1333 memory